GD75232 DATASHEET PDF

GD75232 DATASHEET PDF

August 8, 2020

The GD combines three drivers and five Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. GD Multiple Rs Drivers/receivers. Single Chip With Easy Interface Between UART and Serial-Port Connector of IBM PC/AT and Compatibles Meet or. GD datasheet, GD circuit, GD data sheet: TI – MULTIPLE RS- DRIVERS AND RECEIVERS,alldatasheet, datasheet, Datasheet search.

Author: Dilabar Mujar
Country: Monaco
Language: English (Spanish)
Genre: Life
Published (Last): 3 September 2016
Pages: 43
PDF File Size: 10.48 Mb
ePub File Size: 7.74 Mb
ISBN: 472-4-43582-929-9
Downloads: 76185
Price: Free* [*Free Regsitration Required]
Uploader: Zulkishura

Meet or Exceed the Requirements of.

Designed to Support Data Rates up to. The GD and GD combine three. Texas Instruments trade-standard SN and. SN bipolar quadruple drivers and receivers, respectively. The pinout matches the flow-through design.

The bipolar circuits and processing. These standards are for data interchange between a host computer and a peripheral at signaling. Interoperability at the higher signaling rates cannot be expected. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of. Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

Products conform to specifications per the terms of Texas Instruments. Production processing does not necessarily include. Resistor values shown are nominal. Supply voltage see Note 1: Input voltage range, V I: Driver output voltage range, V O. Receiver low-level output current, I OL. Operating virtual junction temperature, T J. Storage temperature range, T stg.

These are stress ratings only, and. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltages are with respect to the network ground terminal. The maximum allowable power dissipation at any allowable.

Operating at the absolute maximum TJ of ? C can affect reliability. The package thermal impedance is calculated in accordance with JESD Supply voltage see Note 4. High-level input voltage driver only. Low-level input voltage driver only.

  DESIGN SKETCHING BY ERIK OLOFSSON AND KLARA SJOLEN PDF

H igh-level output current. O perating free-air temperature.

gd datasheet pdf storage – PDF Files

When powering up the GD and GD, the following sequence should be used: When powering down the GD and. GD, the reverse sequence should be used.

All inputs at 1.

Supply current from VDD. All inputs at 0. Supply current from VSS. Supply current from VCC. All inputs at 5 V. Low-level output voltage see Note bd75232. High-level short-circuit output current. Low-level short-circuit output current. Output resistance see Note 7. The algebraic convention, where the more positive less negative limit is designated as maximum, is used in this data sheet for logic.

Output short-circuit conditions must maintain the total power dissipation below absolute maximum ratings. See Figure 3 and Note 8. Positive-going input threshold voltage. Negative-going input threshold voltage. H igh-level input current. Propagation delay time, low- to high-level output. Propagation delay time, high- to low-level output.

Transition time, low- to high-level output. Transition time, high- to low-level output. The pulse generator has the following characteristics: CL includes probe and jig capacitance.

GD datasheet & applicatoin notes – Datasheet Archive

Driver Test Circuit and Voltage Waveforms. Receiver Propagation and Transition Times. VI – Input Voltage – V. VO – Output Voltage – V. TA – Free-Air Temperature -? CL – Load Capacitance – pF. All linear dimensions are in inches millimeters. This drawing is subject to change without notice. The 20 pin end lead shoulder width is a vendor option, either half or full width.

Body dimensions do not include mold flash or protrusion not to exceed 0. All linear dimensions are in millimeters. Body dimensions do not include mold flash or protrusion not to exceed 0, Texas Instruments Incorporated and its subsidiaries TI reserve the right to make corrections, modifications.

  GERHANA KEMBAR CLARA NG PDF

Customers should obtain the latest relevant information before placing. All products are sold subject to TI’s terms. TI warrants performance of its hardware products to the specifications applicable at the time of sale in. Testing and other quality control techniques are used to the extent TI. Except where mandated by government requirements, testing of all. TI assumes no liability for applications assistance or customer product design. Customers are responsible for.

GD75232, GD752323, GD75232D

To minimize the risks associated with customer products. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right. Information published by TI regarding third-party products or services. Use of such information may require a license from a third party under the patents or other intellectual property. Reproduction of information in TI data books or data sheets is permissible only if reproduction is without. TI is not responsible or liable for.

Resale of TI products or services with statements different from or beyond the parameters stated by TI for that. TI is not responsible or liable for any such statements. Following are URLs where you can obtain information on other Texas Instruments products and application.

Post Office Box Dallas, Texas

Posted in Politics